銅電析皮膜の表面形態と機械的性質におよぼす不純物の影響 Impurity Effect on Surface Morphologies and Mechanical Properties of Copper Deposits

この論文にアクセスする

この論文をさがす

著者

抄録

We studied how impurities-Cr, Fe, Co, Ni, Zn, Ag, Cd and Sn-in electrolytes, prepared with recycled copper, affect surface morphology and mechanical properties, i.e., tensile strength and elongation-of electrolytic polycrystalline copper deposlts, 35μm thick. In additive concentrations of 0.001 to 10g/dm<sup>3</sup>, we found that Cr, Fe, Co, Ni, Zn and Cd are not introduced into copper deposits. In contrast, Ag and Sn were found in copper deposits at an Ag additive concentration exceeding 0.01g/dm<sup>3</sup> and a Sn additive concentration exceeding 10g/dm<sup>3</sup>. Copper deposit morphology was characterized by the presence of large numbers of bumps surrounded by crystallographical planes and their (220) preferential orientation. For the Sn additive concentration of 10g/dm<sup>3</sup>, however, surface morphology consisted of fine semispherical bumps and an almost random orientation distribution. The tensile strength of copper deposits was found to depend strongly on copper crystallite size, independent of orientation.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 48(11), 1109-1114, 1997-11-01 

    The Surface Finishing Society of Japan

参考文献:  28件

参考文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

各種コード

  • NII論文ID(NAID)
    10002260264
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4334602
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
ページトップへ