Sn-Bi 系はんだの銅板への濡れ性 Wettability of Cu Plate by a Sn-Bi Solder

この論文にアクセスする

この論文をさがす

著者

抄録

For the development of lead-free solder, wettability of 41.2Sn-58.8Bi and 61.6Sn-38.4Pb solders was compared by use of meniscometer. It has been reported by several researchers that the wettability of Sn-Bi solder is poor as compared with Sn-Pb solder. In order to obtain fundamental data, no flux was used in this work because wettability of solder is significantly affected by the kind of flux and the available fluxes have been developed for Sn-Pb solder. Oxygen-free copper plate and copper alloy plate containing 0.3 mass % Cr, 0.1 mass % Zr and 0.02 mass % Si of 0.5mm in thickness and 10mm wide were immersed into the molten solders at the temperature range from 483 K to 543 K. It was found that wettability of both Sn-Bi and Sn-Pb solders to these plates was poor without use of flux. Then a parameter (surface tension) by cosine (contact angle) was used for the comparison of wettability of these solders. No significant difference in the parameter between these solders was observed. Consequently, it is thought that the Sn-Bi solder will be promising provided that flux suitable for this solder is developed.

収録刊行物

  • 資源と素材 : 資源・素材学会誌 : journal of the Mining and Materials Processing Institute of Japan  

    資源と素材 : 資源・素材学会誌 : journal of the Mining and Materials Processing Institute of Japan 113(3), p.205-209, 1997-03 

    The Mining and Materials Processing Institute of Japan

参考文献:  17件

参考文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

被引用文献:  2件

被引用文献を見るにはログインが必要です。ユーザIDをお持ちでない方は新規登録してください。

各種コード

  • NII論文ID(NAID)
    10002283391
  • NII書誌ID(NCID)
    AN10062646
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09161740
  • NDL 記事登録ID
    4172784
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-315
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
ページトップへ