非シアン銀めっきの密着性に及ぽす電極近傍pH変化の影響 Influence of pH Changes near Electrode on Adhesion in Cyanide-Free Silver Deposition

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I<sub>2</sub> concentration in a potassium iodide silver plating solution increases with time in the lower pH range. Which decreases cathode current efficiency in silver deposition, making it necessary to control pH between 4.5 and 5.0. Silver deposits become less adhesive with increasing pH. We studied the effects of pH near electrode surfaces on silver deposit adhesion.<br>We found the following:<br>(1) The pH value near the cathode surface was much greater than that of bulk solution during electrodeposition without a buffer. The addition of KH<sub>2</sub>PO<sub>4</sub> as a buffer markedly reduced the pH change near the electrode.<br>(2) Silver deposit adhesion to undercoated nickel surfaces was improved by adding KH<sub>2</sub>PO<sub>4</sub>.

収録刊行物

  • 表面技術 = The Journal of the Surface Finishing Society of Japan  

    表面技術 = The Journal of the Surface Finishing Society of Japan 49(2), 201-204, 1998-02-01 

    The Surface Finishing Society of Japan

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各種コード

  • NII論文ID(NAID)
    10002446196
  • NII書誌ID(NCID)
    AN1005202X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    09151869
  • NDL 記事登録ID
    4392722
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-291
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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