High-Temperature Deformation and Fracture Behavior of Cu-SiO_2 Bicrystals with[011]Twist Boundaries

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著者

    • MIURA Hiromi
    • Department of Mechanical and Control Engineering, The University of Electro-Communications
    • SAIJO Kazuhide
    • Department of Mechanical and Control Engineering, The University of Electro-Communications
    • SAKAI Taku
    • Department of Mechanical and Control Engineering, The University of Electro-Communications

抄録

Cu–SiO<SUB>2</SUB> bicrystals having [011] twist boundaries with different misorientation angles were tensile tested at various temperatures from 473 to 1173 K. Most bicrystals fractured intergranularly. As the grain-boundary energy increases, intergranular brittle fracture tended to take place more easily at lower temperatures; the ductility of bicrystals with higher energy boundaries became lower. The elongation to fracture of the intergranularly fractured bicrystals decreased monotonically with increase in temperature. These grain boundary dependent characteristics of deformation and fracture behavior of bicrystals could be explained reasonably by considering the difference in grain-boundary sliding and Schmid factor.

収録刊行物

  • Materials transactions, JIM

    Materials transactions, JIM 37(4), 754-761, 1996-04

    社団法人 日本金属学会

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