High-Temperature Deformation and Fracture Behavior of Cu-SiO_2 Bicrystals withTwist Boundaries
Cu–SiO<SUB>2</SUB> bicrystals having  twist boundaries with different misorientation angles were tensile tested at various temperatures from 473 to 1173 K. Most bicrystals fractured intergranularly. As the grain-boundary energy increases, intergranular brittle fracture tended to take place more easily at lower temperatures; the ductility of bicrystals with higher energy boundaries became lower. The elongation to fracture of the intergranularly fractured bicrystals decreased monotonically with increase in temperature. These grain boundary dependent characteristics of deformation and fracture behavior of bicrystals could be explained reasonably by considering the difference in grain-boundary sliding and Schmid factor.
- Materials transactions, JIM
Materials transactions, JIM 37(4), 754-761, 1996-04