High-Temperature Deformation and Fracture Behavior of Cu–SiO<SUB>2</SUB> Bicrystals with [011] Twist Boundaries
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- Miura Hiromi
- Department of Mechanical and Control Engineering, The University of Electro-Communications
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- Saijo Kazuhide
- Department of Mechanical and Control Engineering, The University of Electro-Communications
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- Sakai Taku
- Department of Mechanical and Control Engineering, The University of Electro-Communications
書誌事項
- タイトル別名
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- High-Temperature Deformation and Fracture Behavior of Cu–SiO<SUB>2</SUB> Bicrystals with [011] Twist Boundaries
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Cu–SiO2 bicrystals having [011] twist boundaries with different misorientation angles were tensile tested at various temperatures from 473 to 1173 K. Most bicrystals fractured intergranularly. As the grain-boundary energy increases, intergranular brittle fracture tended to take place more easily at lower temperatures; the ductility of bicrystals with higher energy boundaries became lower. The elongation to fracture of the intergranularly fractured bicrystals decreased monotonically with increase in temperature. These grain boundary dependent characteristics of deformation and fracture behavior of bicrystals could be explained reasonably by considering the difference in grain-boundary sliding and Schmid factor.
収録刊行物
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- Materials Transactions, JIM
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Materials Transactions, JIM 37 (4), 754-761, 1996
社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390001204247760768
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- NII論文ID
- 10002448626
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- NII書誌ID
- AA10699969
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- COI
- 1:CAS:528:DyaK28XjsFyjsLg%3D
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- ISSN
- 2432471X
- 09161821
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- 本文言語コード
- en
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- データソース種別
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- JaLC
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- 使用不可