Thermal Resistance at the Interface between Mold Flux Film and Mold for Continuous Casting of Steels.
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- Cho Jungwook
- Graduate Student, Tohoku University
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- Shibata Hiroyuki
- Institute for Advanced Materials Processing, Tohoku University
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- Emi Toshihiko
- Institute for Advanced Materials Processing, Tohoku University
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- Suzuki Mikio
- Institute for Advanced Materials Processing, Tohoku University
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抄録
Heat transfer from solidifying shell to mold near the meniscus plays an important role for the formation of surface cracks on continuously cast steel products. The heat transfer is influenced substantially by the thermal resistance at the interface between mold flux film and copper mold. Accordingly, a model system consisting of steel shell/mold flux film/copper mold is built to simulate the heat transfer near the meniscus in the mold for continuous casting, and the thermal resistance is determined by measuring temperature gradient in the copper mold in the simulator. The interfacial thermal resistance increases with increasing flux film thickness in contrast to previous observation by others who assumed that the interfacial thermal resistance is constant for different flux film thickness. The interfacial thermal resistance is found to be about 50% of overall thermal resistance for the heat transfer. Mold fluxes for medium carbon steel with higher crystallization temperatures show lower heat flux than those for low carbon steel not due to reduced radiative heat transfer but due to higher interfacial thermal resistance at the same flux film thickness. This arises from the difference in crystallizing behavior such as growth rate of crystalline layer between the two fluxes.
収録刊行物
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- ISIJ International
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ISIJ International 38 (5), 440-446, 1998
一般社団法人 日本鉄鋼協会
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詳細情報 詳細情報について
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- CRID
- 1390282681428661376
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- NII論文ID
- 10002459401
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- NII書誌ID
- AA10680712
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- COI
- 1:CAS:528:DyaK1cXkt1Sltro%3D
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- ISSN
- 13475460
- 09151559
- http://id.crossref.org/issn/00211583
- http://id.crossref.org/issn/09151559
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可