水溶性切削油剤の腐敗防止に関する研究-銅錯体による硫酸還元細菌の生育阻害効果- [in Japanese] Suppression of Bacterial Decomposition in Water-based Cutting Fluids-Effect of copper complexes on the growth of sulfate-reducing bacteria- [in Japanese]
Access this Article
Search this Article
A major problem with water-based cutting fluids is bacterial propagation that can quickly ruin the fluid's effectiveness and cause rancid smell. Effects of copper triethanolamine (Cu-TEA) and copper ethylenediaminetetraacetic acid, disodium (Cu-EDTA) on the colony forming activity of sulfate-reducing bacteria (SRB) have been investigated. The copper complexes were prepared by direct addition of TEA or EDTA to the copper sulfate solution, or by electrolysis with copper electrode in complexing agent solutions. In the copper complexes, the mole ratio of copper ions to TEA or EDTA was 1：1, respectively. The growth of SRB was affected by the addition of Cu-TEA or Cu-EDTA and inhibited strongly at 0.1 mmol dm-3 copper concentration. From the data available, no obvious difference was observed between the copper complexes regarding the colony formation of SRB.
- Journal of MMIJ
Journal of MMIJ 115(4), 240-244, 1999-04-25
The Mining and Materials Processing Institute of Japan