Trends of MCM Application. New MCM Technology. The Substrate with Predrilled and Plated Via Arrays and CAD Layout.

• TAKAHASHI Tamihei

  System Design AE Dept., Mentor Graphics Japan Co., Ltd.

Bibliographic Information

Other Title

• ＭＣＭ実用化の動向　ＭＣＭの新技術　ビアアレイ基板とＣＡＤによる配線
• ビア アレイ キバン ト CAD ニヨル ハイセン

Journal

• The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

  The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11 (5), 361-364, 1996

  The Japan Institute of Electronics Packaging

Details

• CRID: 1390001204664917888
• NII Article ID: 10002522333
• NII Book ID: AN10564349
• DOI: 10.5104/jiep1995.11.361
• ISSN: 18841201
• ISSN: 13410571
• NDL BIB ID: 4020870
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4020870
• Web Site: http://www.jstage.jst.go.jp/article/jiep1995/11/5/11_5_361/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles