Trends of MCM Application. Infrastructure Technology. Bare Chip Mounting System-Flip Chip Bonder.

• OZONO Mitsuru

  Production Engineering Research Laboratory, Kyushu Matsushita Electric Co., Ltd.

Bibliographic Information

Other Title

• ＭＣＭ実用化の動向　インフラ技術　組立設備―フリップチップボンダ
• クミタテ セツビ フリップチップボンダ

Journal

• The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

  The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11 (5), 370-374, 1996

  The Japan Institute of Electronics Packaging

Details

• CRID: 1390001204665423232
• NII Article ID: 10002522344
• NII Book ID: AN10564349
• DOI: 10.5104/jiep1995.11.370
• ISSN: 18841201
• ISSN: 13410571
• NDL BIB ID: 4020873
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4020873
• Web Site: http://www.jstage.jst.go.jp/article/jiep1995/11/5/11_5_370/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles