微小ピッチTAB/OLB技術 [in Japanese] Fine Pitch TAB/OLB Technology [in Japanese]
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Novel OLB technology onto PWB at 0.15mm lead pitch by means of soldering method has been developed. This technology includes two types of OLB structures which can be adopted for many kinds of applications. One is a lead-forming type in which leads are bent in the shape of gull wings, and the other is a non-lead-forming type. In the technology, the outer leads are connected to the PWB electrodes only with electro-plated solder on the outer leads, through non-cleaning process. It was confirmed that the samples using the developed tech-niques showed good results in terms of reliability and this OLB system proved to be a practical use level.
- Journal of The Japan Institute of Electronics Packaging
Journal of The Japan Institute of Electronics Packaging 13(1), 30-36, 1998-01-20
The Japan Institute of Electronics Packaging