Removal of Organic Compounds from Metallographic Surfaces Using Cold Concentrated Sulfuric Acid

• Awane Tohru

  Kobe Material Testing Laboratory Co. Ltd, Division of Technical Support

Bibliographic Information

Other Title

• 冷濃硫酸を用いた検鏡金属試料面の有機系付着物除去

Abstract

A new convenient method has been developed to remove adhesive organic compounds with high chemical resistance (e.g. epoxy resin) from metallographic surfaces without damaging the surfaces.<BR>Epoxy resin has been found to be readily removed in the following process: 1) rapid cooling in liquid nitrogen and mechanical crushing of bulk resin, 2) swelling the residual resin in an organic solvent, 3) decomposition of the resin in cold concentrated sulfuric acid, 4) washed with saturated aqueous solution of sodium bicarbonate, and 5) blank replica.<BR>This method has been found effective for metals with moderate corrosion resistance.

Journal

• Journal of the Japan Institute of Metals and Materials

  Journal of the Japan Institute of Metals and Materials 63 (4), 551-552, 1999

  The Japan Institute of Metals and Materials

Keywords

• resin on the metallographic surfaces
• swelling in organic solvent
• decomposition of resin in cold sulfuric acid
• neutralization in saturated aqueous solution of sodium bicarbonate
• blank replica

Details

• CRID: 1390001206490754944
• NII Article ID: 10002549965
• NII Book ID: AN00062446
• DOI: 10.2320/jinstmet1952.63.4_551
• ISSN: 18806880
• ISSN: 24337501
• ISSN: 00214876
• Web Site: https://www.jstage.jst.go.jp/article/jinstmet1952/63/4/63_4_551/_pdf
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed