Influence of Cu content on A. C. electrograining behaivior of Al-Mn alloy

• SUZUKI Hideki

  Nippon Light Metal Company, Ltd.

• NISHIKAWA Yasuhisa

  Nippon Light Metal Company, Ltd.

Bibliographic Information

Other Title

• Al-Mn系合金板の交流電解エッチング特性に及ぼすCuの影響

Journal

• 大会講演概要

  大会講演概要 92 141-142, 1997-05

Details

• CRID: 1574231873817018368
• NII Article ID: 10002557978
• NII Book ID: AN10268641
• Text Lang: ja
• Data Source:
  • CiNii Articles