Qualification of Underfills, Fluxes and Solder Resist for Flip Chip Applications

DOI Web Site Web Site 25 References

Search this article

Abstract

<p>The compatibility of flip chip fluxes, underfill epoxies and solder resists on printed circuit boards (PCB) was compared by using a single lap shear test.1-3,15) The underfill adhesion to the plain solder resist was generally good, but in flip chip assembly, a flux for joining the connections of flip chips is used. Therefore, the PCB samples coated with different solder resists were fluxed and reflowed to simulate the real production environment. The underfill was applied on these residues and another piece of PCB, treated in same way was attached on it maintaining a consistent gap between two pieces. The underfill was cured according to each manufacturer's specification and a single lap shear test was carried out. The correlation of the variable results was verified by assembling a test flip chip using some of the tested materials and subjecting them into temperature cycling. The adhesion strength was verified by investigating underfill delamination by scanning acoustic microscopy (SAM).</p>

Journal

  • Electrochemistry

    Electrochemistry 67 (8), 850-854, 1999-08-05

    The Electrochemical Society of Japan

References(25)*help

See more

Keywords

Details 詳細情報について

Report a problem

Back to top