Qualification of Underfills, Fluxes and Solder Resist for Flip Chip Applications

• TUOMINEN Aulis

  Electronics Laboratory, Nokia Research Center

• LEHTINEN Ville

  Electronics Laboratory, Nokia Research Center

• RISTOLAINEN Eero

  Electronics Department, Tampere University of Technology

抄録

The compatibility of flip chip fluxes, underfill epoxies and solder resists on printed circuit boards (PCB) was compared by using a single lap shear test.^1-3,15) The underfill adhesion to the plain solder resist was generally good, but in flip chip assembly, a flux for joining the connections of flip chips is used. Therefore, the PCB samples coated with different solder resists were fluxed and reflowed to simulate the real production environment. The underfill was applied on these residues and another piece of PCB, treated in same way was attached on it maintaining a consistent gap between two pieces. The underfill was cured according to each manufacturer's specification and a single lap shear test was carried out. The correlation of the variable results was verified by assembling a test flip chip using some of the tested materials and subjecting them into temperature cycling. The adhesion strength was verified by investigating underfill delamination by scanning acoustic microscopy (SAM).

収録刊行物

• Electrochemistry

  Electrochemistry 67 (8), 850-854, 1999-08-05

  公益社団法人　電気化学会

キーワード

• Underfill Adhesion
• Flux
• Solder Resist Com-Patibility
• Flip Chip Reliability

詳細情報

• CRID: 1390001277392974464
• NII論文ID: 10002568187
• NII書誌ID: AN00151637
• DOI: 10.5796/electrochemistry.67.850
• ISSN: 21862451
• ISSN: 13443542
• NDL書誌ID: 4821056
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4821056
• Web Site: https://www.jstage.jst.go.jp/article/electrochemistry/67/8/67_850/_pdf
• 本文言語コード: en
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• 抄録ライセンスフラグ: 使用可