高周波多層プリント配線板用熱硬化型ポリフェニレンエーテル樹脂の特性評価

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タイトル別名
  • The Evaluation of Thermosetting Polyphenylene Ether for High Frequency Multilayer Printed Circuit Boards.

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Thermosetting PPE resin S2100 was developed as an insulating material for multilayer printed circuit boards, which has both high glass transition temperature and excellent dielectric characteristics. Powder free prepreg was obtained by impregnating S2100 into E-glass cloth. Resin flow of S2100 prepreg was good enough to produce copper clad laminates and multilayer printed wiring boards. S2100 laminate was evaluated and found to have both superior dielectric properties, such as ε=3.5, tanδ=0.003 at 1MHz, and high Tg of 210°C. Durometer hardness and copper foil peel strength of S2100 at 200°C showed smaller change than those of FR-4.Therefore, it is supposed that S2100 laminate is useful as the material for recent LSI packages, that require low dielectric constant, small signal transmission loss, and durability for wire bonding process. Moreover, S2100 laminate was found to be drilled more easily than FR-4. Drill wear and roughness of through hole of S2100 were smaller than those of FR-4. Dielectric constant and dissipation factor of S2100 laminate at 1GHz were constant values of 3.3 and 0.005 throughout the whole temperature range between-20°Cand 80°C, respectively. Signal transmission loss for S2100 laminate was found to be less than 0.1dB/cm below 7GHz. Pressure vessel test of 1000 hours was carried out as an acceleration for reliability test. The results showed that the stability of dielectricity and solder resistance of S2100 laminate were superior to FR-4, because of the fact that S2100 laminate had low water absorption of 0.4%. Copper ion migration test showed S2100 laminate had 101 higher insulating resistance than FR-4 during the test. S2100 multilayer printed wiring board was proved to have superior properties in temperature-humidity cycle test, solder dip test, oil dip test, and thermal shock test.

収録刊行物

  • 回路実装学会誌

    回路実装学会誌 10 (3), 153-160, 1995

    一般社団法人 エレクトロニクス実装学会

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