Effect of Ni Addition into Electroless Pd-P Plating Films as a Contact Material of Electronic Components

• OSAKA Tetsuya

  Department of Applied Chemistry ; Kagami Memorial Laboratory for Materials Science and Technology, Waseda University

• OZAWA Susumu

  Department of Applied Chemistry ; Kagami Memorial Laboratory for Materials Science and Technology, Waseda University

• OKABE Tomooki

  Department of Applied Chemistry ; Kagami Memorial Laboratory for Materials Science and Technology, Waseda University

• YOSHIOKA Osamu

  System's Material Laboratory, Hitachi Cable, Ltd.

• OKINAKA Yutaka

  Advanced Research Center for Science and Engineering Waseda University

Bibliographic Information

Other Title

• 電子部品用接点材料としての無電解Pd-Pめっき皮膜へのNi添加効果

Journal

• 回路実装学会誌

  回路実装学会誌 10 (4), 253-257, 1995-07-20

Details

• CRID: 1571698599019971072
• NII Article ID: 10002644450
• NII Book ID: AN10564349
• ISSN: 13410571
• Text Lang: ja
• Data Source:
  • CiNii Articles