JPCAショー'95レポート

• 越地 耕二

  東京理科大学

Bibliographic Information

Other Title

• ―回路実装学会企画参加―

Journal

• The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

  The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10 (4), 261-263, 1995

  The Japan Institute of Electronics Packaging

Details

• CRID: 1390001204666831104
• NII Article ID: 10002644464
• NII Book ID: AN10564349
• DOI: 10.5104/jiep1995.10.261
• ISSN: 18841201
• ISSN: 13410571
• Web Site: http://www.jstage.jst.go.jp/article/jiep1995/10/4/10_4_261/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles