Micro-Interconnection Technology. Production Engineering of Micro Connections in Stud-Bump-Bonding Packaging.

• KUMAGAI Koichi

  Circuits Manufacturing Technology Laboratory, Corporate Production Engineering Division, Matsushita Electric Industrial Co., Ltd.

• KABESHITA Akira

  Circuits Manufacturing Technology Laboratory, Corporate Production Engineering Division, Matsushita Electric Industrial Co., Ltd.

• YAMAZAKI Osamu

  Circuits Manufacturing Technology Laboratory, Corporate Production Engineering Division, Matsushita Electric Industrial Co., Ltd.

Bibliographic Information

Other Title

• マイクロ接続技術　ＳＢＢマイクロ接合技術

Journal

• The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

  The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10 (6), 368-372, 1995

  The Japan Institute of Electronics Packaging

Details

• CRID: 1390282679643217408
• NII Article ID: 10002644470
• NII Book ID: AN10564349
• DOI: 10.5104/jiep1995.10.368
• ISSN: 18841201
• ISSN: 13410571
• Web Site: http://www.jstage.jst.go.jp/article/jiep1995/10/6/10_6_368/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles