Micro-Interconnection Technology. Thermal Fatigue Strength Evaluation of BGA Package Solder Joints.

• EBIHARA Yoshinori

  Department of Engineering, Faculty of Education, Tokyo Gakugei University

Bibliographic Information

Other Title

• マイクロ接続技術　ＢＧＡパッケージはんだ接合部の熱疲労強度評価

Journal

• The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

  The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 10 (6), 394-400, 1995

  The Japan Institute of Electronics Packaging

Details

• CRID: 1390001204666573312
• NII Article ID: 10002644508
• NII Book ID: AN10564349
• DOI: 10.5104/jiep1995.10.394
• ISSN: 18841201
• ISSN: 13410571
• Web Site: http://www.jstage.jst.go.jp/article/jiep1995/10/6/10_6_394/_pdf
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles