ＴＡＢ，ＦＰＣのマイクロ接合（ノジュラーコネクション）

• 石井 正人

  三井金属鉱業株式会社総合研究所

• 片岡 龍男

  三井金属鉱業株式会社総合研究所

書誌事項

タイトル別名

• Micro Connection of TABs or FPCs(Nodular Connection).

抄録

New Micro Connection Technology called“Nodular Connection”was developed for fine pitch FPC terminals or for TAB outer leads. Noduler Connection consists of the following processes. Dendrites (nodules) were formed vertically on the outer leads or the terminals by the electro-deposition in a special copper plating bath. An adhesive, liquid or sheet, was placed between TAB (or FPC) with dendrites on outer leads (terminals) and ITO transparent electrodes (or PCB terminals) . After position adjustment, compressive force was applied to close the gap between both circuits so that electric contact was obtained through the dendrites. The suitable dendrites formation was obtained under a plating bath composition; Cu: 8g/l, H₂SO₄: 100g/l, α or βNaphtoquinoline: 50 mg/l, and special electrolytic condition. Using these dendrites, Nodular Connections were carried out and their reliability and characteristics were determined by the environmental tests. The contact resistance of Nodular Connection was 1/10 to 1/100 of those of the common ACFs (Anisotropic Conductive Films) .

収録刊行物

• 回路実装学会誌

  回路実装学会誌 10 (6), 401-407, 1995

  一般社団法人 エレクトロニクス実装学会

詳細情報

• CRID: 1390282679643218432
• NII論文ID: 10002644559
• NII書誌ID: AN10564349
• DOI: 10.5104/jiep1995.10.401
• ISSN: 18841201
• ISSN: 13410571
• Web Site: http://www.jstage.jst.go.jp/article/jiep1995/10/6/10_6_401/_pdf
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可