Separation Property Under Melting and Symulation of Soldering on Fine Pitch LSI Package

• YAMAMOTO Kenichi

  ULSI Production Engineering Department, Semiconductor Development Ceter, Semicondector & Integrated Circuits Division, Hitachi, Ltd.

• LEE Chahn

  The 2nd Material Department, Hitachi Research Laboratory, Hitachi Ltd.

• SHIMOKAWA Hanae

  Electronics Engineering Technology Center, Production Engineering Research Laboratory, Hitachi Ltd.

• ISHIDA Toshiharu

  Electronics Engineering Technology Center, Production Engineering Research Laboratory, Hitachi Ltd.

• SOGA Tasao

  Electronics Engineering Technology Center, Production Engineering Research Laboratory, Hitachi Ltd.

Bibliographic Information

Other Title

• 狭ピッチLSI接続におけるはんだ溶融分離とそのシミュレーション

Journal

• 回路実装学会誌

  回路実装学会誌 10 (6), 408-415, 1995-09-01

Details

• CRID: 1571135649066570624
• NII Article ID: 10002644568
• NII Book ID: AN10564349
• ISSN: 13410571
• Text Lang: ja
• Data Source:
  • CiNii Articles