-
- 多田 邦雄
- 回路実装学会 東京大学大学院工学系研究科
Search this article
Journal
-
- The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
-
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 11 (1), Preface-Preface, 1996
The Japan Institute of Electronics Packaging
- Tweet
Details 詳細情報について
-
- CRID
- 1390001204666815744
-
- NII Article ID
- 10002644667
- 130004165334
-
- NII Book ID
- AN10564349
-
- ISSN
- 18841201
- 13410571
-
- Text Lang
- ja
-
- Data Source
-
- JaLC
- Crossref
- CiNii Articles