Development of Overmolded BGA Packages by IME BGA Consortium

• CHAKRAVORTY K. K.

  Institute of Microelectronics

• CHONG Chai Tai

  Institute of Microelectronics

• TEO Yong Chua

  Institute of Microelectronics

• TAN Geok Leong

  Institute of Microelectronics

• BHANDARKAR S. N.

  Institute of Microelectronics

• LIM T. B.

  Institute of Microelectronics

• NG C. M.

  Hitachi Chemical (s) Pte Ltd.

• LIAN S. C.

  Microfits Pte Ltd.

Bibliographic Information

Other Title

• シンガポールにおけるBGAパッケージの開発

Journal

• 回路実装学会誌

  回路実装学会誌 11 (3), 177-180, 1996-05-20

Details

• CRID: 1573387448880232576
• NII Article ID: 10002644856
• NII Book ID: AN10564349
• ISSN: 13410571
• Text Lang: ja
• Data Source:
  • CiNii Articles