表面の合焦測度比と2次元的特徴量評価に基づくはんだバンプ検査

• 斉藤 文彦

  岩手県立大学

書誌事項

タイトル別名

• Solder bump inspection by evaluating focusing ratio on surface and two-dimensional features
• ヒョウメン ノ ゴウショウソクドヒ ト 2ジゲンテキ トクチョウリョウ ヒョウカ ニ モトズク ハンダバンプ ケンサ

抄録

This paper proposes a method to inspect forms of solder bumps located on the surface of a semiconductor bare chip. The form of a solder bump is inspected by evaluating the two-dimensional features observed from the vertical view and by measuring the change of the optical focus on the surface of the solder bump when the Z-stage is moved once using the vertical coaxial illumination and the dome-typed uniform illumination. As the experimental result, the method for measuring the focus on the surface of the solder bump which evaluates the summary of differential brightness by the Prewitt operator had the best performance. Also, the detection rate of defective solder bumps reached 95.6% and the inspection time was 0.3 second to a solder bump.

収録刊行物

• 電気学会論文誌Ｄ（産業応用部門誌）

  電気学会論文誌Ｄ（産業応用部門誌） 119 (1), 8-13, 1999

  一般社団法人 電気学会

キーワード

• はんだバンプ
• 形状検査
• 合焦測度
• ベアチップ

詳細情報

• CRID: 1390282679636245760
• NII論文ID: 10002727738
• NII書誌ID: AN10012320
• DOI: 10.1541/ieejias.119.8
• ISSN: 13488163
• ISSN: 09136339
• NDL書誌ID: 970639
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I970639
• Web Site: http://www.jstage.jst.go.jp/article/ieejias1987/119/1/119_1_8/_pdf
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
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