Measurement of Deformation and Temperature Rise of Wire Bonding Using Linear and Complex Vibration Systems --Studies on Ultrasonic Wire Bonding by a Complex Vibration Welding Tip(Report. 23)--

• TSUJINO Jiromaru

  Faculty of Engineering, KANAGAWA University

• YOSHIHARA Hiroyuki

  Faculty of Engineering, KANAGAWA University

• OSADA Yoshiaki

  Faculty of Engineering, KANAGAWA University

• KAMIMOTO Kazuyoshi

  Faculty of Engineering, KANAGAWA University

Bibliographic Information

Other Title

• 超音波ワイヤーボンディングの溶接時の変形および温度上昇の測定 -複合振動を用いた超音波ワイヤーボンディング(23)-

Journal

• 日本音響学会研究発表会講演論文集

  日本音響学会研究発表会講演論文集 1996 (2), 1069-1070, 1996-09-01

Details

• CRID: 1573668923858527360
• NII Article ID: 10002741786
• NII Book ID: AN00351181
• ISSN: 13403168
• Text Lang: ja
• Data Source:
  • CiNii Articles