High reliable press packed IGBT

• Matsuda Hideo

  Toshiba

• Kawamura Noriyasu

  Toshiba

• Hiyoshi Michiaki

  Toshiba

• Teramae Satoshi

  Toshiba

• Nishitani Kazunobu

  Toshiba

Bibliographic Information

Other Title

• 高信頼圧接型IGBT
• コウシンライ アッセツガタ IGBT

Abstract

Newly developed press packed reverse conducting IGBT (RCIGBT): ST1000EX21, having 2500V-1000A rating, has realized the use in high reliability required application area. Multiple chips press packed RCIGBT structure, containing IGBT chips and fast recovery diode (FRD) chips, has been achieved founded on the basic experimental results and the stress analysis using finite element structure analysis program ABAQUS. Excellent electrical characteristics, especially tough turn-off capability, such as Ic=5000A, Vcp=2800V at Tj=125°C, have been obtained. And high reliability, withstanding the thermal cycling (fatigue) test more than 50, 000 cycles and the high temperature voltage blocking test for 2, 000 hours, has been confirmed. The device is now available and successfully used for transportation systems and the other applications, which require high reliability and long term stability. Voltage and current ratings in IGBTs and IEGTs are now going to be expanded to higher grade.

Journal

• IEEJ Transactions on Electronics, Information and Systems

  IEEJ Transactions on Electronics, Information and Systems 118 (9), 1285-1291, 1998

  The Institute of Electrical Engineers of Japan

Keywords

• IGBT

Details

• CRID: 1390001204608360960
• NII Article ID: 130006844117
• NII Article ID: 10002814866
• NII Book ID: AN10065950
• DOI: 10.1541/ieejeiss1987.118.9_1285
• ISSN: 13488155
• ISSN: 03854221
• NDL BIB ID: 4548606
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4548606
• Web Site: https://www.jstage.jst.go.jp/article/ieejeiss1987/118/9/118_9_1285/_pdf
• Data Source:
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  • CiNii Articles
• Abstract License Flag: Disallowed