Migration of Conductive Ink using Silver-Copper Solid Solution Powder

• Fujiki Satoshi

  Toyama Industrial Technology Center

• Sato Jiro

  Asahi Chemical Industry Co. Ltd.

• Tatsuyama Chiei

  Toyama University

書誌事項

タイトル別名

• Migration of Conductive Ink using Silve

抄録

We developed the conductive ink using silver (Ag) -copper (Cu) solid solution powder and investigated an ionic migration phenomenon of the conductive ink. The conductive ink is made by dispersing the powder in phenol resin. This powder has a shell structure. The Ag concentration at the surface of the powder is higher than an average Ag concentration in the bulk, and Ag concentration decreases toward inside of the powder. The Ag concentration of about 85 wt% in the Ag-rich phase dose not strongly depend on the average Ag concentration, and the thickness of Ag-rich phase increase with the average Ag concentration. Though this ink includes Ag, in which ionic migration occurs most easily, and Cu, which is oxidized easily, the migration occurrence of this ink including the powder with Ag of 5 wt% was similar to that of Cu conductive ink and Ag migration was not observed.

収録刊行物

• 電気学会論文誌．　Ａ

  電気学会論文誌．　Ａ 118 (3), 268-273, 1998

  一般社団法人 電気学会

キーワード

• migration
• silver-copper solid solution powder
• conductive ink
• graded structure

詳細情報

• CRID: 1390282679575081728
• NII論文ID: 130006838305
• NII論文ID: 10002823806
• NII書誌ID: AN10136312
• DOI: 10.1541/ieejfms1990.118.3_268
• ISSN: 13475533
• ISSN: 03854205
• NDL書誌ID: 4412943
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4412943
• Web Site: https://www.jstage.jst.go.jp/article/ieejfms1990/118/3/118_3_268/_pdf
• 本文言語コード: en
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可