Engineering Plastics-Recent Developments in Synthesis and Applications. Thermosetting Mechanism of Poly((phenylsilylene)ethynylene-1,3-phenyleneethynylene).

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  • エンジニアリングプラスチック‐合成技術と応用技術の新展開　耐熱性ケイ素系高分子ポリ（フェニルシリレンエチニレン‐１，３‐フェニレンエチニレン）の熱硬化機構の解析
  • タイネツセイ ケイソケイ コウブンシ ポリ フェニルシリレンエチニレン 1 3

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Abstract

Poly [(phenylsilylene) ethynylene-1, 3-phenyleneethynylene] (MSP) which contains Si-H and C≡C bonds gives a very highly thermally stable polymer by curation above 150°C. In this study, we determined thermosetting mechanism of MSP from the 13C and 29Si solid-state NMR methods and chemical calculations. From these results, we concluded that the intermolecular cross-linking reactions owing to 1) the Diels-Alder reaction between Ph-C≡C and C≡C and 2) the hydrosilylation reaction between Si-H and C≡C proceeded at 150-200°C. A very highly thermally stable structure is formed. Only the hydrosilylation reaction occurs above 300°C.

Journal

  • KOBUNSHI RONBUNSHU

    KOBUNSHI RONBUNSHU 54 (4), 229-235, 1997

    The Society of Polymer Science, Japan

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