The Optimized Solder Bond for Ceramic Chip Carrier on Ceramic Boards
収録刊行物
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- Proc. 1983 Int'l Microelectronics Symposium, Int'l Society for Hybrid Microelectronics
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Proc. 1983 Int'l Microelectronics Symposium, Int'l Society for Hybrid Microelectronics 217-222, 1983