電位勾配を有するアルミニウム合金のクラッド材の孔食成長 Pitting growth on clad aluminum alloys with potential slope

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著者

    • 当摩 建 TOHMA Ken
    • 三菱アルミニウム(株)技術開発センター Technical Development Center MITSUBISHI ALUMINIUMU Co, Ltd.

抄録

Pitting growth mechanism in dilute chloride solution on clad aluminum alloys having potential slope was investigated by an electrochemical technique. The ability of pitting growth in the direction of thickness was determined by the relation between effects of positive potential slope by additional elements and of negative potential slope by concentration of Cl<sup>−</sup> at the pit bottom. In dilute chloride solution, pitting grew in the direction of thickness in spite of potential slope if it was gentle. Not only positive potential slope, but also potential defference of more than 90 mV between core alloy and sacrificial anode is required to protect core alloys for 7 days in tap water containing 1 ppm Cu<sup>2+</sup>.

収録刊行物

  • 軽金属

    軽金属 46(2), 83-88, 1996-02-28

    The Japan Institute of Light Metals

参考文献:  11件中 1-11件 を表示

被引用文献:  1件中 1-1件 を表示

各種コード

  • NII論文ID(NAID)
    10003793474
  • NII書誌ID(NCID)
    AN00069773
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    04515994
  • NDL 記事登録ID
    3926735
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-284
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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