Fatigue-Strength Prediction of Microelectronics Solder Joints under Thermal Cyclic Loading
収録刊行物
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- Fifth Intersociety Conference on Thermal Phenomena in Electronic Systems, 1996, Fifth Intersociety Conference on Thermal Phenome
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Fifth Intersociety Conference on Thermal Phenomena in Electronic Systems, 1996, Fifth Intersociety Conference on Thermal Phenome 151-157, 1996