A Meyhod of Fatigue Life Prediction for Surface-Mount Solder Joints of Electronic Devices by Mechanical Fatigue Test

• UEGAI Y.

収録刊行物

• ASME, Advances in Electronic Packaging EEP

  ASME, Advances in Electronic Packaging EEP 4 493-498, 1993

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• NII論文ID: 10003868969
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