Polimer Flip Chip P_F C : A Technology Assessment of Solderless Bump Processes and Reliability

• ESTES R.

収録刊行物

• Proceedings of the Adhesives in Electronics 94, Berlin, November 2-4

  Proceedings of the Adhesives in Electronics 94, Berlin, November 2-4 1994

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• CRID: 1573387448940786560
• NII論文ID: 10003990654
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