Room temperature bonding of substrate materials for integration of microsystem

• TAKAGI

収録刊行物

• Proc. Int. Workshop on Microfactory

  Proc. Int. Workshop on Microfactory 93-98, 1998

詳細情報

• CRID: 1571698599174713088
• NII論文ID: 10004259383
• データソース種別:
  • CiNii Articles