プリント配線板のマイグレーション劣化と低周波誘電特性との関係

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  • Relation between Dielectric Characteristics at Low Frequency and Degradation of Printed Wiring Board by Ionic Migration
  • プリント ハイセンバン ノ マイグレーション レッカ ト テイシュウハ ユウデン トクセイ ト ノ カンケイ

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Degradation of the printed wiring board due to the ionic migration was evaluated by the measurements of capacitance (C) and tan δ between the conductors on the board in a frequency range of 0.6-1000Hz. The material of the insulating board used was fiberglass reinforced epoxy (Fr-4). The configuration of wiring conductor (Cu) on the board was designed according to IPC-SM-840. A distance between the conductors was 0.165mm. The endurance test was performed by applying DC70V to the conductors on the board, which was set in a chamber controlled at 85°C and 85%RH.In the low frequency region (_??_10Hz), C and tan 6 increase 800-1000h after the voltage application. After the detection of the increase, C and tan δ in the low frequency region fluctuate with the laps of time. The fluctuation for the low frequency region is much greater than that for the high frequency region (_??_60Hz). It is confirmed that the sudden increases in C and tan δ in the low frequency region coincide with an appearance of the migration on the insulating board between the conductors. Whereas in the high frequency region, the coincidence is unobserved. The migration in early stage can be detected by the increases of C and tan δ in the low frequency region, which will be due to the low mobility of ions in the water film on the board between the conductors. The ions in the water film may be Cu ions migrated from conductors.

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