TEM Observation of Solder Joints using Focused Ion Beam Process

2 References
  • MATSUKI H.
    LSI Assembly & Packaging Development Div., Fujitsu Limited
  • IBUKA H.
    Dept.of Quantum Eng., Nagoya Univ.
  • SAKA H.
    Dept.of Quantum Eng., Nagoya Univ.

Bibliographic Information

Other Title
  • FIB加工による半田接合部のTEM観察

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Details 詳細情報について

  • CRID
    1572543024135353728
  • NII Article ID
    10004539109
  • NII Book ID
    AN00145000
  • ISSN
    04170326
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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