TEM Observation of Artificial Grain Boundary of Directly Bonded Silicon Wafers

1 References
  • ITO S.
    Institute for Materials Research, Tohoku University
  • SEKIGUCHI T.
    Institute for Materials Research, Tohoku University
  • IKEDA K.
    Institute for Materials Research, Tohoku University
  • SUEZAWA M.
    Institute for Materials Research, Tohoku University

Bibliographic Information

Other Title
  • 直接貼り合わせ法によって形成したSiウエハの人工界面の透過電顕観察

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Details 詳細情報について

  • CRID
    1571698599205222016
  • NII Article ID
    10004539168
  • NII Book ID
    AN00145000
  • ISSN
    04170326
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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