アルミニウムとアルミナの超音波接合 Ultrasonic bonding of aluminum to alumina

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Two kinds of alumina with 99.5% and 91.0% purity were ultrasonically bonded to aluminum. The effect of thermal conductivity, hardness and the content of SiO<sub>2</sub> in the alumina on the strength of a joint were examined. Results obtained are summarized as follows. Under the condition of bonding pressure of 882 N and applying time of ultrasonic vibration for 1.0 s, an excellent joint is stably achieved in both alumina. The strength of the Al–91% alumina joint is higher than that of the Al–99.5% alumina joint. It seems that the effect of the thermal conductivity of the alumina on the strength of the joint is small, however, the temperature at the interface between Al and 91% alumina with lower thermal conductivity is higher by about 15°C than that between Al and 99.5% alumina. Although 99.5% alumina harder than 91% alumina tends to facilitate the breakup of Al surface oxide film and exposure of clean surface at the interface, the effect of the difference in hardness of the alumina on the strength of the joint is small.

収録刊行物

  • 軽金属  

    軽金属 50(7), 313-319, 2000-07-30 

    The Japan Institute of Light Metals

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各種コード

  • NII論文ID(NAID)
    10004549272
  • NII書誌ID(NCID)
    AN00069773
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    04515994
  • NDL 記事登録ID
    5411602
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-284
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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