シリコン酸化膜成長過程の表面応力変動 Surface Stress in the Growth of Silicon Oxide Layer

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We present the evolution of surface stress of Si (100) at the oxide film thickness from 0 to 5 nm. Using micromechanical cantilevers, we have measured surface stress evolution during plasma oxidation with applying positive bias to the samples and observed five stages in surface stress. The stress curve depending on oxidation time showed a quick buildup of compressive stress, followed by a tensile stress formation, gradually changed to tensile one and compressive stress appeared again. In the second stage, the formation of tensile stress suggests a oxygen-bridged dimer structure. Only the last compressive stress have been known as a intrinsic stress in silicon oxide film of 10 nm to 1000 nm, which due to the lattice mismatch of Si and SiO<SUB>2</SUB>. For the cases of oxidation with applying negative biases, stress curves showed different time dependence from that with positive bias. They showed three stages, the first two stages which were observed in the case of positive bias did not appear.

収録刊行物

  • 真空  

    真空 42(10), 929-932, 1999-10-20 

    The Vacuum Society of Japan

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各種コード

  • NII論文ID(NAID)
    10004568601
  • NII書誌ID(NCID)
    AN00119871
  • 本文言語コード
    JPN
  • 資料種別
    SHO
  • ISSN
    05598516
  • NDL 記事登録ID
    4892114
  • NDL 雑誌分類
    ZN15(科学技術--機械工学・工業--流体機械)
  • NDL 請求記号
    Z16-474
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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