Process Technology for Micromachines. Precise Hole Array Drilling of Ceramics by Excimer Laser Photo-ablation Process.
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- Nakamura Kazuhito
- Asea Brown Boveri
Bibliographic Information
- Other Title
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- マイクロマシン加工技術 エキシマレーザによるセラミックス材料の超微細穴加工
- エキシマ レーザ ニヨル セラミックス ザイリョウ ノ チョウ ビサイ アナカ
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Abstract
A precise drilling technology with cross section control for use on thin ceramic materials has been developed using Excimer laser photo-ablation process. An homogenous illumination optical system and projection system of high resolution optical elements are applied to a newly designed mass production system. Homogeneity of laser energy under±5% on the mask surface has been obtained by the illumination system, making a final hole array with a distribution of exit hole diameter of 3.5±0.7μm in one processing field of 1.2×1.2mm square area. If a crack occurs in the process because of high repetition rate or high energy from the laser, productivity declines. Designing a specimen holder and He-gas assist enabled cracks to be avolded even at high repetition rate of 200Hz.<br>This paper describes hole array drilling technique with cross section control of ceramics by multi musk method, production system and an application.
Journal
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- IEEJ Transactions on Sensors and Micromachines
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IEEJ Transactions on Sensors and Micromachines 117 (1), 15-19, 1997
The Institute of Electrical Engineers of Japan
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Details 詳細情報について
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- CRID
- 1390001204460265344
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- NII Article ID
- 10004831823
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- NII Book ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL BIB ID
- 4106303
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed