Sensing Head for Ultrasonic Transducer made by Direct Bonding (特集「センサ・アクチュエ-タ用無機機能性薄膜プロセス技術」) Sensing Head for Ultrasonic Transducer made by Direct Bonding

この論文にアクセスする

この論文をさがす

抄録

A sensing head for a high frequency ultrasonic transducer was created by direct bonding between Al and Pb(Zr, Ti) O<sub>3</sub> (PZT). The forming of hydrogen bridges at the interface was used as the bonding method in this study. After the surface was treated hydrophilically by bombardment of positive ions formed by introducing water into an ion source, the hydrophilictreated surfaces were placed in contact with each other and heated at above 250°C in the air. It was determined that the bonded device had sufficient bonding strength. In respect to characteristics of acoustic wave propagation, the signal is not distorted by the multiple reflections in the direct bonding interface. The frequency of the ultrasonic transducer was 17MHz. Thus, the high frequency sonar has ahigh resolution. The present bonding method may be successful for assembling the ultrasonic transducer of a micromachine.

収録刊行物

  • 電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society

    電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society 117(10), 513-518, 1997-10

    The Institute of Electrical Engineers of Japan

参考文献:  10件中 1-10件 を表示

  • <no title>

    MO J. H.

    Proceedings of IEEE Ultrasonics Symposium 801, 1989

    被引用文献1件

  • <no title>

    CHIHARA K.

    Dig.of World Congress on Med.Phy.and Bio.Eng., 1991

    被引用文献1件

  • <no title>

    LEE C. K.

    Proceedings of IEEE Ultrasonics Symposium 691, 1991

    被引用文献1件

  • <no title>

    SCHWARZ H. P.

    Proceedings of IEEE Ultrasonics Symposium 687, 1989

    被引用文献1件

  • <no title>

    HAISMA J.

    App.Opt. 33, 1154, 1994

    被引用文献1件

  • <no title>

    SUGA T.

    Ceramic Transactions 35, 323, 1993

    被引用文献1件

  • <no title>

    NAGAKUBO M.

    The 3rd IUMRS International Conference on Advanced Materials 1191, 1995

    被引用文献1件

  • <no title>

    PAULING L.

    The Nature of the Chemical Bond, 1960

    被引用文献52件

  • <no title>

    SUZUKI H.

    Microjoining and Assembly Technology, 1995

    被引用文献1件

  • <no title>

    STENGL R.

    Jpn.J.Appl.Phy. 28, 1735, 1989

    被引用文献1件

各種コード

  • NII論文ID(NAID)
    10004832685
  • NII書誌ID(NCID)
    AN1052634X
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    13418939
  • NDL 記事登録ID
    4304110
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-B380
  • データ提供元
    CJP書誌  NDL  J-STAGE 
ページトップへ