A Flip Chip Bonding Technology Using Gold Pillars for Millimeter-Wave Applications

• AOKI S.

収録刊行物

• IEEE MTT-S Intl. Microwave Symp.Digest

  IEEE MTT-S Intl. Microwave Symp.Digest 731-734, 1997

詳細情報

• CRID: 1572261549141740416
• NII論文ID: 10004833476
• データソース種別:
  • CiNii Articles