高段差ピット底部におけるリフトオフパターニングプロセス Lift-Off Patterning Process at the Bottom of a Deep Pit

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抄録

We have newly developed Lift-Off patterning process at the bottom of a deep pit. This process consists of fabricating positive photoresist profiles with overhangs using a sacrificial Aluminum layer in order to form precisely thin film electrode patterns. Using this process, the thin film deposited on the photoresist can be completely separated from the other portions of the thin film deposited on the substrate. Au/Pt/Ti thin film electrodes which are 750nm thickness in total can be obtained at the bottom of a pit which is 30 μ m depth without any defects by realizing overhanging edges which are 800nm height and 8 μ m undercut. The deflection of pattern width of Au/Pt/Ti thin film electrodes is under ±3 μ m.

収録刊行物

  • 電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society  

    電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society 119(1), 32-37, 1999-01-01 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10004833719
  • NII書誌ID(NCID)
    AN1052634X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13418939
  • NDL 記事登録ID
    970624
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-B380
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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