高段差ピット底部におけるリフトオフパターニングプロセス [in Japanese] Lift-Off Patterning Process at the Bottom of a Deep Pit [in Japanese]
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We have newly developed Lift-Off patterning process at the bottom of a deep pit. This process consists of fabricating positive photoresist profiles with overhangs using a sacrificial Aluminum layer in order to form precisely thin film electrode patterns. Using this process, the thin film deposited on the photoresist can be completely separated from the other portions of the thin film deposited on the substrate. Au/Pt/Ti thin film electrodes which are 750nm thickness in total can be obtained at the bottom of a pit which is 30 μ m depth without any defects by realizing overhanging edges which are 800nm height and 8 μ m undercut. The deflection of pattern width of Au/Pt/Ti thin film electrodes is under ±3 μ m.
- The Journal of the Institute of Electrical Engineers of Japan
The Journal of the Institute of Electrical Engineers of Japan 119(1), 32-37, 1999-01-01
The Institute of Electrical Engineers of Japan