The Microassembly Technique for a 3D Single Crystaalline Silicon Structure Using a Polyimide/Chromium Cantilever [in Japanese]
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The microassembly technique on the wafer is key technology to realize multi-axis sensors (e. g. magnetometer) or three-dimensional micro systems (e. g. an optical system). We have investigated the bending of a polyimide/chromium cantilever to lift a silicon island (400×300×10μm<sup>3</sup> and 1000×1000×240μm<sup>3</sup>) on the wafer at an angle of 90°, the planarization of a diced silicon sidewall and the bonding of a silicon island to the planarized silicon sidewall with polyimide interlayer. With this microassembly technique, the three-dimensional single crystalline silicon structures have been fabricated.
- The Journal of the Institute of Electrical Engineers of Japan
The Journal of the Institute of Electrical Engineers of Japan 119(4), 236-241, 1999-04
The Institute of Electrical Engineers of Japan