MEMS材料としてのNi-W合金メッキ膜 Study of Ni-W alloy as a MEMS Material

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In micro mechanical devices with high aspect ratios, LIGA or LIGA-like processes are commonly used. In such a process, the material of the device structure is electroplated with nickel or copper because of ease of deposition. In this paper, an alternative material, electroplated nickel-tungsten alloy is examined as an MEMS material. Preliminary results of measurements of the mechanical, chemical and magnetoelectrical properties are shown and discussed. It is found that the Ni-W alloy film shows excellent characteristics such as low internal friction, high chemical resistance.

収録刊行物

  • 電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society  

    電気学会論文誌. E, センサ・マイクロマシン準部門誌 = The transactions of the Institute of Electrical Engineers of Japan. A publication of Sensors and Micromachines Society 119(11), 598-603, 1999-11 

    The Institute of Electrical Engineers of Japan

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各種コード

  • NII論文ID(NAID)
    10004834658
  • NII書誌ID(NCID)
    AN1052634X
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    13418939
  • NDL 記事登録ID
    4892839
  • NDL 雑誌分類
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL 請求記号
    Z16-B380
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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