Study of Ni-W alloy as a MEMS Material

• Ikeda Hidehiro

  Department of Electronics, Himeji Institute of Technology

• Ioku Sunao

  Department of Electronics, Himeji Institute of Technology

• Fujita Takayuki

  Department of Electronics, Himeji Institute of Technology

• Maenaka Kazusuke

  Department of Electronics, Himeji Institute of Technology

• Maeda Muneo

  Department of Electronics, Himeji Institute of Technology

Bibliographic Information

Other Title

• MEMS材料としてのNi-W合金メツキ膜
• MEMS ザイリョウ ト シテ ノ Ni-W ゴウキン メッキ マク

Abstract

In micro mechanical devices with high aspect ratios, LIGA or LIGA-like processes are commonly used. In such a process, the material of the device structure is electroplated with nickel or copper because of ease of deposition. In this paper, an alternative material, electroplated nickel-tungsten alloy is examined as an MEMS material. Preliminary results of measurements of the mechanical, chemical and magnetoelectrical properties are shown and discussed. It is found that the Ni-W alloy film shows excellent characteristics such as low internal friction, high chemical resistance.

Journal

• IEEJ Transactions on Sensors and Micromachines

  IEEJ Transactions on Sensors and Micromachines 119 (11), 598-603, 1999

  The Institute of Electrical Engineers of Japan

Keywords

• LlGA

Details

• CRID: 1390001204462611968
• NII Article ID: 10004834658
• NII Book ID: AN1052634X
• DOI: 10.1541/ieejsmas.119.598
• ISSN: 13475525
• ISSN: 13418939
• NDL BIB ID: 4892839
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4892839
• Web Site: http://www.jstage.jst.go.jp/article/ieejsmas1995/119/11/119_11_598/_pdf
• Data Source:
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• Abstract License Flag: Disallowed