Development of Ultra-miniaturized Multilayer Ceramic Chip Components and Multilayer Module.

• Fujimoto Masayuki

  Taiyo Yuden Co., Ltd.

Bibliographic Information

Other Title

• 電子部品・材料　　超小型積層セラミックチップ部品と積層モジュールの開発
• ジュショウ キネン コウエン ヘイセイ 12ネンド ギジュツ コウセキショウ チョウコガタ セキソウ セラミックチップ ブヒン ト セキソウ モジュール ノ カイハツ

Abstract

High-speed laser drilling using low laser power and flexible circuit layout were applied to the fabrication of 3-dimensional circuits in multilayer ceramics of miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials realized ultra-fine through-holes formed in thin ceramic green sheets without damaging plastic film where ceramic slurry was cast. Laser drilling based on thermal ablation.

Journal

• Journal of the Japan Society of Powder and Powder Metallurgy

  Journal of the Japan Society of Powder and Powder Metallurgy 49 (3), 203-210, 2002

  Japan Society of Powder and Powder Metallurgy

Keywords

• YAG laser
• Machining
• Multilayer chip inductors
• Ceramic multilayer modules

Details

• CRID: 1390001206308330368
• NII Article ID: 10008007590
• NII Book ID: AN00222724
• DOI: 10.2497/jjspm.49.203
• ISSN: 18809014
• ISSN: 05328799
• NDL BIB ID: 6126538
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I6126538
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• Abstract License Flag: Disallowed