セラミック電子部品製造における回転焼成法の開発 Rotary Firing Method for the Manufacturing of Ceramic Electronic Devices
Ceramic electronic components have generally been manufactured by the static firing of green bodies in a sagger. In this paper, we studied a dynamic rotary firing method in which the sagger is rotated during the firing process. It prevented shape defect such as bending and sticking between samples, and reduced the distribution of the electric characteristics. It was found that the optimized sample locations in a sagger and conditions of rotations prevented appearance defect and reduced the distribution of dimensions even when green bodies were put at random locations. It was proved that the introduction of the rotary firing process could improve the productivity and reduce the energy consumption and especially the manufacturing cost drastically when the manufacturing scale is appropriate for it.
粉体および粉末冶金 49(3), 223-227, 2002-03-15
Japan Society of Powder and Powder Metallurgy