セラミック電子部品製造における回転焼成法の開発 Rotary Firing Method for the Manufacturing of Ceramic Electronic Devices

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著者

    • 沖中 秀行 OKINAKA Hideyuki
    • 松下電子部品(株)開発技術センター Matsushita Electronic Components Co., Ltd. Corporate Components Development Center

抄録

Ceramic electronic components have generally been manufactured by the static firing of green bodies in a sagger. In this paper, we studied a dynamic rotary firing method in which the sagger is rotated during the firing process. It prevented shape defect such as bending and sticking between samples, and reduced the distribution of the electric characteristics. It was found that the optimized sample locations in a sagger and conditions of rotations prevented appearance defect and reduced the distribution of dimensions even when green bodies were put at random locations. It was proved that the introduction of the rotary firing process could improve the productivity and reduce the energy consumption and especially the manufacturing cost drastically when the manufacturing scale is appropriate for it.

収録刊行物

  • 粉体および粉末冶金

    粉体および粉末冶金 49(3), 223-227, 2002-03-15

    Japan Society of Powder and Powder Metallurgy

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各種コード

  • NII論文ID(NAID)
    10008007634
  • NII書誌ID(NCID)
    AN00222724
  • 本文言語コード
    JPN
  • 資料種別
    REV
  • ISSN
    05328799
  • NDL 記事登録ID
    6126579
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-274
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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