MIM プロセスにおけるW-Cu系放熱部材の開発 Development of W-Cu System Alloy for Heat Sinks by MIM Techniques
W-Cu system alloys are promising for thermal managing applications such as microelectronic devices because of the low thermal coefficient of W and the high thermal conductivity of Cu. These materials have been produced by conventional Cu-infiltration sintering or liquid-phase sintering. However, the infiltration sintering process has complicated and many steps, and also the constituent phases are often segregated in the form of Cu pool.<BR>For the homogeneous constituent phases, in this study, the new concept of sintering was suggested by the application of the W-Cu composite powders to MIM process which is hoped to be an advanced powder processing technique for near net shape forming the high density, high performance, and complicated components.<BR>Optimal thermal conductivity of the W-15mass%Cu-0.5mass%Co composite powder compact was obtained by sintering at 1673 K for 3.6 ks in H<SUB>2</SUB>; the relative density and the thermal conductivity were 92.5% and 151.0 W/mK, respectively.
粉体および粉末冶金 49(6), 531-533, 2002-06-15
Japan Society of Powder and Powder Metallurgy