MIM プロセスにおけるW-Cu系放熱部材の開発 Development of W-Cu System Alloy for Heat Sinks by MIM Techniques

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W-Cu system alloys are promising for thermal managing applications such as microelectronic devices because of the low thermal coefficient of W and the high thermal conductivity of Cu. These materials have been produced by conventional Cu-infiltration sintering or liquid-phase sintering. However, the infiltration sintering process has complicated and many steps, and also the constituent phases are often segregated in the form of Cu pool.<BR>For the homogeneous constituent phases, in this study, the new concept of sintering was suggested by the application of the W-Cu composite powders to MIM process which is hoped to be an advanced powder processing technique for near net shape forming the high density, high performance, and complicated components.<BR>Optimal thermal conductivity of the W-15mass%Cu-0.5mass%Co composite powder compact was obtained by sintering at 1673 K for 3.6 ks in H<SUB>2</SUB>; the relative density and the thermal conductivity were 92.5% and 151.0 W/mK, respectively.

収録刊行物

  • 粉体および粉末冶金

    粉体および粉末冶金 49(6), 531-533, 2002-06-15

    Japan Society of Powder and Powder Metallurgy

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各種コード

  • NII論文ID(NAID)
    10008833558
  • NII書誌ID(NCID)
    AN00222724
  • 本文言語コード
    JPN
  • 資料種別
    ART
  • ISSN
    05328799
  • NDL 記事登録ID
    6190685
  • NDL 雑誌分類
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL 請求記号
    Z17-274
  • データ提供元
    CJP書誌  CJP引用  NDL  J-STAGE 
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