書誌事項
- タイトル別名
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- FE-SEM observation on the interfacial ultrastructure of the modified one-bottle one-step type resin bonding agent
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Recently, the AQ Bond Plus has been developed with the improvement on the previous AQ Bond by Sun Medical Co. The AQ Bond Plus does not have to be applied to the cavitywalls twice, and can be cured with any kind of the visible light curing unit such as a halogenlamp unit, a xenon lamp unit, or an LED unit. The purpose of this study was to examinethe interfacial ultrastructure between the AQ Bond Plus and enamel/intact dentin/caries-affected dentin under the FE-SEM by means of the Ar-ion beam etching technique. The AQ Bond Plus showed a tight interfacial junction to enamel/intact dentin/caries-affecteddentin without creating hybrid layer which was revealed in the SEM images of theconventional resin bonding systems. From the results of this study, there was a doubtwhether the resin impregnated dentin, namely hybrid layer was an indispensable factor forresin bonding to dentin.
収録刊行物
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- 接着歯学
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接着歯学 21 (2), 140-149, 2003
日本接着歯学会
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詳細情報 詳細情報について
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- CRID
- 1390001204349889024
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- NII論文ID
- 130003845652
- 10011677351
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- NII書誌ID
- AN10044236
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- ISSN
- 21859566
- 09131655
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可